, Inc., a global leader in high-performance semiconductors for signal processing applications, and Netopia
, Inc., a market leader in broadband gateways and service delivery software, announced that Netopia has adopted ADI's FusivTM
network processor and new ADSL2+ bonding reference platform as a foundation for Netopia's MiAVo bonded ADSL2+ gateways.
ADI's design win is part of the growing adoption of ADSL2+ bonding solutions among carriers and service providers. "Driving faster speeds to the customer is important, but in addition to performance, cost matters for mass-market rollouts. The way that ADSL2+ bonding increases bandwidth while fitting with carriers' existing copper access connections is what makes it interesting," said Sam Lucero, industry analyst for Networking at In-Stat.
Netopia's recently announced MiAVo family of triple-play gateways feature high performance wide area network (WAN) interfaces with innovative new local area network (LAN) distribution technologies for the delivery of triple-play services across fiber, VDSL, and bonded ADSL2+ networks. The new Netopia family of bonded ADSL2+ gateways is ideal for carriers and service providers seeking to deliver triple-play services across their upgraded ADSL2+ bonded networks.
Analog Devices' ADSL2+ bonding reference design, which includes its high-performance Fusiv and EaglePlusTM
technologies, is compliant with the recent ITU-T G.998.1 (G.bond-ATM) bonding standard. ADSL2+ loop bonding allows carriers to combine two or more existing copper phone lines into a single connection that delivers high-bandwidth access. Carriers and service providers gain the advantage of a quick, low-cost way to reach more subscribers with advanced broadband services such as VoIP, IP television (IPTV), and triple-play bundles of voice, data, and video. The flexibility of ADI's Fusiv network processing technology enables optimal performance and bill-of-materials (BOM) cost for bonded ADSL2+ CPEs.
Said Ken Haase, vice president of product management at Netopia, "Netopia has always led the market in the delivery of new broadband gateway technology. We see ADSL2+ bonding taking off, with a noticeable uptick in carrier requests for gateway solutions to service their new high-performance networks. Basing our Netopia MiAVo bonded ADSL2+ gateway on the ADI platform is giving us a speed-to-market advantage to establish a leadership position for ADSL2+ bonded solutions."
"ADSL2+ bonding lets service providers maximize the performance of -- and investments in -- their current access infrastructure to compete in the triple-play arena now," said Tony Zarola, strategic business manager for broadband products at Analog Devices. "And the residential CPE is a vital link in the chain of service delivery.
"Providing a competitive design advantage and field-proven, standards-compliant ADSL technology to CPE manufacturers like Netopia highlights yet another facet of ADI's ongoing commitment to, and leadership role in, shaping the fast-moving broadband market," Zarola added.
The new ADI ADSL2+ bonding platform was developed in tandem with Aware, Inc. The design combines ADI's Fusiv network processor and two or more EaglePlus ADSL2/2+ PHY devices, based on Aware's StratiPHY2+TM
intellectual property, to achieve bonded link rates of 48Mbps and above. ADI's ADSL2+ bonding platform is designed primarily to support ATM layer bonding, and as successfully demonstrated at SUPERCOMM 2005, has full interoperability with leading DSLAMs (digital subscriber line access multiplexers).